ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,551, issued on June 30, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "Transformer-based isolator with sense coil" was inven... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,552, issued on June 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Passive semiconductor device" was i... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,553, issued on June 30, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package having a chi... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,554, issued on June 30, was assigned to Jentech Precision Industrial Co. LTD. (Taoyuan City, Taiwan). "Package structure and method of manu... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,555, issued on June 30, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Ryuta Yaginuma (Kyoto, Japan).... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,556, issued on June 30, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Clips for semiconductor package and r... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,557, issued on June 30, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Chip high-density interconnection package ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,558, issued on June 30, was assigned to Altera Corp. (San Jose, Calif.). "Package substrate with power delivery network" was invented by Lo... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,559, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Low insertion loss coaxial through-hole for highspeed input-oup... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,560, issued on June 30, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Semiconductor device including semiconductor ... Read More